Secondary curing is a process of removing low-molecular-weight siloxane at high temperature of 200 to 220 degrees C., a substance that decays the surface of electric contact and becomes a cause of disrupting the electric contact. Due to the nature of siloxane, it is very difficult to remove it entirely, so we lower the siloxane level to the greatest possible extent under complete control.

Test report download
Test report for quantitative analysis of cyclic siloxane after our secondary curing process		(1,016KB)

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